JPH0749815Y2 - 表面実装型光結合装置 - Google Patents
表面実装型光結合装置Info
- Publication number
- JPH0749815Y2 JPH0749815Y2 JP1990078414U JP7841490U JPH0749815Y2 JP H0749815 Y2 JPH0749815 Y2 JP H0749815Y2 JP 1990078414 U JP1990078414 U JP 1990078414U JP 7841490 U JP7841490 U JP 7841490U JP H0749815 Y2 JPH0749815 Y2 JP H0749815Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- lead frame
- light emitting
- coupling device
- optical coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000008878 coupling Effects 0.000 title claims description 20
- 238000010168 coupling process Methods 0.000 title claims description 20
- 238000005859 coupling reaction Methods 0.000 title claims description 20
- 230000003287 optical effect Effects 0.000 title claims description 19
- 229920005989 resin Polymers 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 44
- 238000000465 moulding Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990078414U JPH0749815Y2 (ja) | 1990-07-23 | 1990-07-23 | 表面実装型光結合装置 |
US07/731,780 US5214495A (en) | 1990-07-23 | 1991-07-18 | Photointerrupter and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990078414U JPH0749815Y2 (ja) | 1990-07-23 | 1990-07-23 | 表面実装型光結合装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0436262U JPH0436262U (en]) | 1992-03-26 |
JPH0749815Y2 true JPH0749815Y2 (ja) | 1995-11-13 |
Family
ID=13661382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990078414U Expired - Lifetime JPH0749815Y2 (ja) | 1990-07-23 | 1990-07-23 | 表面実装型光結合装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5214495A (en]) |
JP (1) | JPH0749815Y2 (en]) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5647034A (en) * | 1994-10-03 | 1997-07-08 | Matsushita Electric Works, Ltd. | Operation displaying semiconductor switch |
KR100542869B1 (ko) * | 1996-10-22 | 2006-05-23 | 로무 가부시키가이샤 | 포토인터럽터 |
US6288492B1 (en) | 2000-06-14 | 2001-09-11 | Trw Inc. | Head lamp switch with twilight sentinel control |
JP4801243B2 (ja) * | 2000-08-08 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | リードフレームおよびそれを用いて製造した半導体装置並びにその製造方法 |
JP2005026546A (ja) * | 2003-07-04 | 2005-01-27 | Toshiba Corp | フォトインタラプタとその製造方法及び光結合装置とその製造方法 |
JP2005064140A (ja) * | 2003-08-08 | 2005-03-10 | Toshiba Corp | フォトインタラプタ及びその製造方法 |
DE102004038422B3 (de) * | 2004-07-30 | 2006-01-12 | Schefenacker Vision Systems Germany Gmbh | Sensoreinrichtung, Verwendung einer Sensoreinrichtung sowie Fahrzeugleuchte |
KR100631901B1 (ko) * | 2005-01-31 | 2006-10-11 | 삼성전기주식회사 | Led 패키지 프레임 및 이를 채용하는 led 패키지 |
JP2006269777A (ja) * | 2005-03-24 | 2006-10-05 | Rohm Co Ltd | 面実装型フォトインタラプタとその製造方法 |
TWI373149B (en) * | 2005-03-24 | 2012-09-21 | Rohm Co Ltd | Surface mount type photo interrupter and method for manufacturing the same |
JP2007027621A (ja) * | 2005-07-21 | 2007-02-01 | Rohm Co Ltd | 面実装型フォトインタラプタとその製造方法 |
TWD134353S (zh) | 2008-06-20 | 2010-04-11 | 西鐵城電子股份有限公司 | 光遮斷器 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1789005A1 (de) * | 1968-09-20 | 1972-01-20 | Siemens Ag | Eingekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen |
DE2806167C2 (de) * | 1978-02-14 | 1986-05-15 | Siemens AG, 1000 Berlin und 8000 München | Hochspannungsfester Optokoppler |
FR2436505A1 (fr) * | 1978-09-12 | 1980-04-11 | Radiotechnique Compelec | Dispositif optoelectronique a emetteur et recepteur couples |
JPS6193682A (ja) * | 1984-10-15 | 1986-05-12 | Sharp Corp | ホトインタラプタの製造法 |
US4694183A (en) * | 1985-06-25 | 1987-09-15 | Hewlett-Packard Company | Optical isolator fabricated upon a lead frame |
US4633582A (en) * | 1985-08-14 | 1987-01-06 | General Instrument Corporation | Method for assembling an optoisolator and leadframe therefor |
JPS6278887A (ja) * | 1985-10-01 | 1987-04-11 | Sharp Corp | ホトインタラプタ |
JPH0638514B2 (ja) * | 1985-11-21 | 1994-05-18 | 日本電気株式会社 | フオトインタラプタ |
JP3039651B2 (ja) * | 1988-07-13 | 2000-05-08 | キヤノン株式会社 | 強誘電性カイラルスメクチック液晶組成物及びこれを有する液晶素子 |
JPH0224387A (ja) * | 1988-07-13 | 1990-01-26 | Canon Inc | 液晶組成物およびこれを含む液晶素子 |
US5081520A (en) * | 1989-05-16 | 1992-01-14 | Minolta Camera Kabushiki Kaisha | Chip mounting substrate having an integral molded projection and conductive pattern |
-
1990
- 1990-07-23 JP JP1990078414U patent/JPH0749815Y2/ja not_active Expired - Lifetime
-
1991
- 1991-07-18 US US07/731,780 patent/US5214495A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0436262U (en]) | 1992-03-26 |
US5214495A (en) | 1993-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |